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- Description
EXTREME PERFORMANCE: Straight-fin design with twice the height of other heatsinks for extra heat dissipation performance whether actively or passively cooled. Mandatory for applications in high temperature, encased, or overclocked environments.
LONG LASTING EXACT FIT: CPU and LAN chipset heatsinks are fabricated specifically for the Raspberry Pi 3 Model B+ and Raspberry Pi 3 Model B. Double-sided 3M thermal transfer tape offers high thermal conductivity and long lasting adhesion in all mounting scenarios.
QUICK AND SIMPLE INSTALLATION: Peel and stick in the orientation with the most airflow. Most effective solution for reliable performance and longevity.
NO MORE THROTTLING: Reduce chip hot-spots and increase thermal dissipation surface area by 10x. For Raspberry Pi 3 Model B, cooling amplification for CPU area is over 100x! Say goodbye to temperature based performance throttling and maintain consistent maximum performance.
MUST HAVE FOR RASPBERRY PI 3: At full load, BCM2837 SoC will reach 100
LONG LASTING EXACT FIT: CPU and LAN chipset heatsinks are fabricated specifically for the Raspberry Pi 3 Model B+ and Raspberry Pi 3 Model B. Double-sided 3M thermal transfer tape offers high thermal conductivity and long lasting adhesion in all mounting scenarios.
QUICK AND SIMPLE INSTALLATION: Peel and stick in the orientation with the most airflow. Most effective solution for reliable performance and longevity.
NO MORE THROTTLING: Reduce chip hot-spots and increase thermal dissipation surface area by 10x. For Raspberry Pi 3 Model B, cooling amplification for CPU area is over 100x! Say goodbye to temperature based performance throttling and maintain consistent maximum performance.
MUST HAVE FOR RASPBERRY PI 3: At full load, BCM2837 SoC will reach 100
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